Wei Teng Chang

Title: Wei Teng Chang - Innovator in Semiconductor Technology

Introduction

Wei Teng Chang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the design and functionality of semiconductor device packages. His innovative approach has led to the development of a unique patent that enhances the performance of semiconductor devices.

Latest Patents

Wei Teng Chang holds a patent titled "Dam structure on lid to constrain a thermal interface material in a semiconductor device package structure and methods for forming the same." This patent describes a semiconductor device that includes a package substrate, a first semiconductor die coupled to the package substrate, and a package lid that covers the semiconductor die. A thermal interface material is strategically located between the top surface of the semiconductor die and the internal surface of the package lid. The invention features a dam formed on the internal surface of the package lid, which effectively constrains the thermal interface material during a reflow operation, ensuring optimal performance.

Career Highlights

Wei Teng Chang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work focuses on enhancing semiconductor device packaging, which is crucial for the efficiency and reliability of electronic devices. His innovative contributions have positioned him as a key figure in his field.

Collaborations

Throughout his career, Wei Teng Chang has collaborated with esteemed colleagues, including Meng-Tsung Kuo and Chih-Kung Huang. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies in semiconductor packaging.

Conclusion

Wei Teng Chang's contributions to semiconductor technology through his innovative patent and work at Taiwan Semiconductor Manufacturing Company Limited highlight his importance in the industry. His advancements in thermal interface materials and packaging structures are paving the way for more efficient electronic devices.