Wei-Tao Shaw

Title: Wei-Tao Shaw: Innovator in Semiconductor Technology

Introduction

Wei-Tao Shaw is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of innovative packaging solutions. His work has implications for the efficiency and performance of electronic devices.

Latest Patents

Wei-Tao Shaw holds a patent for "Semiconductor packages with through via structures and methods for testing the same." This patent describes a semiconductor package that includes an array of through-substrate-via (TSV) structures. The array comprises a number of active TSV structures and contact structures, which are configured to receive and provide test signals. This innovation enhances the testing capabilities of semiconductor packages, making them more efficient and reliable.

Career Highlights

Wei-Tao Shaw is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role involves research and development, where he focuses on advancing semiconductor packaging technologies. His expertise has contributed to the company's reputation for innovation and quality in semiconductor manufacturing.

Collaborations

Throughout his career, Wei-Tao Shaw has collaborated with notable colleagues, including Ying-Chih Hsu and Jui-Cheng Huang. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Wei-Tao Shaw is a key figure in the semiconductor industry, with a focus on innovative packaging solutions. His contributions, particularly through his patent, demonstrate his commitment to advancing technology in this critical field.