Location History:
- Taichung Hsien, TW (2007)
- Taichung, TW (2016)
Company Filing History:
Years Active: 2007-2016
Title: Innovations of Wei-Sheng Lin in Wire Bonding Technology
Introduction
Wei-Sheng Lin is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of wire bonding technology, holding a total of 3 patents. His innovative approaches have enhanced production efficiency and reliability in semiconductor manufacturing.
Latest Patents
Wei-Sheng Lin's latest patents include a "Wire bonding device and method of eliminating defective bonding wire." This invention provides a method for eliminating defective bonding wires by moving a bonding member from one region of a carrier to another. The process involves the cooperative operation of a movement member and the bonding member to remove the defective wire, thereby improving production efficiency. Another notable patent is the "Method for fabricating wire bonding structure," which details a technique for foaming a ball end of a bonding wire on bonding pads. This method prevents delamination of small-sized ball ends from the bonding pads, ensuring better reliability in wire bonding applications.
Career Highlights
Wei-Sheng Lin is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His work focuses on developing advanced wire bonding techniques that are crucial for the production of high-quality electronic components.
Collaborations
Throughout his career, Wei-Sheng Lin has collaborated with notable colleagues, including Lien-Chen Chiang and Lung-Tang Hung. These collaborations have fostered innovation and contributed to the advancement of wire bonding technologies.
Conclusion
Wei-Sheng Lin's contributions to wire bonding technology have significantly impacted the semiconductor industry. His innovative patents and collaborative efforts continue to drive advancements in production efficiency and reliability.