Company Filing History:
4 out of 778 
4 out of 1,231 
Years Active: 2007-2008
Title: The Innovative Mind of Wei-Qiang Tian
Introduction
Wei-Qiang Tian, an accomplished inventor based in Shenzhen, China, has made significant strides in the field of thermal management through his four patented inventions. His work focuses on enhancing heat dissipation technologies, reflecting his deep understanding of thermal dynamics and engineering principles.
Latest Patents
Wei-Qiang's latest patents demonstrate his innovative approach to heat dissipation devices. One notable invention includes a heat dissipation device featuring a heat sink, a fan, and an air-guiding member that efficiently directs airflow. This design allows for increased airflow to the hotter sections of the heat sink, optimizing heat transfer and improving performance.
Another patent illustrates a heat dissipation device with a retention module encasing a heat-generating component. This device incorporates a heat sink that can rotate, effectively reducing the adhering force of thermal grease between the base and the component, further enhancing thermal management.
Career Highlights
Throughout his career, Wei-Qiang has worked with prominent companies in the technology sector, including Fu Zhun Precision Industry Co., Ltd., and Foxconn Technology Co., Ltd. His contributions to these organizations have propelled advancements in product design and performance, particularly in thermal solutions that are critical in various electronic applications.
Collaborations
Wei-Qiang Tian has collaborated with talented individuals in the industry, including coworkers Tao Li and Wan-Lin Xia. These partnerships have facilitated the exchange of ideas and fostered innovation, leading to the development of cutting-edge technologies aimed at resolving complex thermal challenges.
Conclusion
In conclusion, Wei-Qiang Tian stands out as an inventive force in the realm of heat dissipation technology. His patents reflect a commitment to innovation and an understanding of the critical nature of effective thermal management in electronic devices. As he continues to push the boundaries of engineering solutions, his work will undoubtedly leave a lasting impact on the industry.