Wei Ping Wang

Title: Innovations of Wei Ping Wang in Electronic Packaging

Introduction

Wei Ping Wang is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, particularly through his innovative patent. His work focuses on enhancing the reliability and efficiency of electronic components.

Latest Patents

Wei Ping Wang holds a patent for an "Electronic package and method for fabricating the same." This invention provides a method that includes disposing an electronic component on a substrate, forming an encapsulant layer on the substrate to encapsulate the electronic component, and creating a shielding layer made of metal on the encapsulant layer. The shielding layer features an extending portion that reaches the lateral side of the substrate along a corner of the encapsulant layer, without extending to the lower side of the substrate. This design prevents the shielding layer from contacting conductive pads on the lower side of the substrate, thereby avoiding potential short circuits. He has 1 patent to his name.

Career Highlights

Wei Ping Wang is associated with Siliconware Precision Industries Co., Ltd., a company known for its advancements in semiconductor packaging and testing. His role in the company has allowed him to contribute to cutting-edge technologies in the electronics industry.

Collaborations

Throughout his career, Wei Ping Wang has collaborated with talented individuals such as Kaun-I Cheng and Shu-Chi Chang. These collaborations have fostered innovation and have been instrumental in the development of new technologies in electronic packaging.

Conclusion

Wei Ping Wang's contributions to electronic packaging through his innovative patent demonstrate his expertise and commitment to advancing technology in this field. His work continues to influence the industry and enhance the reliability of electronic components.