Hsinchu, Taiwan

Wei-Ming Tseng

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Macroblock, Inc.. Active years: 2023-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wei-Ming Tseng. Retrieved from https://idiyas.com/inventor/wei-ming-tseng-2dyhznb0

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2023-2024

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2 patents (USPTO):Explore Patents

Title: Innovations of Wei-Ming Tseng

Introduction

Wei-Ming Tseng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of light-emitting diode technology. With a total of 2 patents, his work focuses on enhancing the efficiency and functionality of micro light-emitting diodes (micro-LEDs).

Latest Patents

One of his latest patents is a "Mixed light light-emitting diode device." This invention includes first, second, and third chips, each having a first-type semiconductor layer with a first surface, a second-type semiconductor layer with a second surface opposite to the first surface, and a third surface indenting from the first surface and situated on the second-type semiconductor layer. The second and third chips have their first surfaces disposed above and facing the first surface of the first chip. A first-type electrode penetrates through the second and first surfaces of the first chip and contacts all first surfaces of the first, second, and third chips. Two second-type electrodes each penetrate through the second and third surfaces of the first chip and connect the first chip to one of the second and third chips.

Another significant patent is the "Method for transferring micro light emitting diodes." This method includes forming a plurality of micro light emitting diode (micro-LED) chips having an epitaxial stacked layer and an electrode on a base. It involves attaching the electrodes of the micro-LED chips to a temporary substrate and removing the base from the micro-LED chips. A light shielding layer is formed on the temporary substrate, followed by a light-transmissible packaging layer to cover the light shielding layer and the micro-LED chips. The temporary substrate is then removed to form a light emitting assembly, which is divided to separate a plurality of pixels constituted by the micro-LEDs, and finally, the pixels are transferred to a permanent substrate.

Career Highlights

Wei-Ming Tseng is currently associated with Macroblock, Inc., where he continues to innovate in the field of micro-LED technology. His work has been instrumental in advancing the capabilities of light-emitting devices.

Collaborations

One of his notable coworkers is Shih-Sian Liang, who contributes to the collaborative efforts in their projects.

Conclusion

Wei-Ming Tseng's contributions to the field of micro-LED technology through his patents

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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