The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2024

Filed:

Sep. 22, 2021
Applicant:

Macroblock, Inc., Hsinchu, TW;

Inventors:

Shih-Sian Liang, Hsinchu, TW;

Wei-Ming Tseng, Hsinchu, TW;

Assignee:

MACROBLOCK, INC., Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/38 (2010.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/382 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01);
Abstract

A mixed light light-emitting diode device includes first, second, and third chips, each having a first-type semiconductor layer with a first surface, a second-type semiconductor layer with a second surface opposite to the first surface, and a third surface indenting from the first surface and situated on the second-type semiconductor layer. The second and third chips have their first surfaces disposed above and facing the first surface of the first chip. A first-type electrode penetrates through the second and first surfaces of the first chip and contacts all first surfaces of first, second, and third chips. Two second-type electrodes each penetrates through the second and third surfaces of the first chip and connect the first chip to one of the second and third chips.


Find Patent Forward Citations

Loading…