Company Filing History:
Years Active: 2012
Title: Innovations of Wei-Lun Cheng
Introduction
Wei-Lun Cheng is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on advanced packaging structures that enhance electrical connections and reliability.
Latest Patents
Wei-Lun Cheng's latest patents include the "Advanced quad flat non-leaded package structure and manufacturing method thereof." This innovative package structure consists of a carrier, a chip, a plurality of wires, and a molding compound. The carrier features a die pad and multiple leads, with first leads surrounding the die pad and second leads positioned around the first leads. An embedded lead portion is located between the first and second leads, allowing for improved electrical connections. The manufacturing method involves a pre-cutting process before the backside etching process, which defines the contact terminals and enhances package reliability.
Career Highlights
Wei-Lun Cheng is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise in this area has positioned him as a key player in the industry.
Collaborations
Some of his coworkers include Pao-Huei Chang Chien and Ping-Cheng Hu, who contribute to the innovative environment at Advanced Semiconductor Engineering, Inc.
Conclusion
Wei-Lun Cheng's contributions to semiconductor packaging through his patents and work at Advanced Semiconductor Engineering, Inc. highlight his role as an influential inventor in the field. His innovations continue to shape the future of semiconductor technology.