The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
Aug. 31, 2009
Applicants:
Pao-huei Chang Chien, Kaohsiung County, TW;
Ping-cheng HU, Kaohsiung, TW;
Po-shing Chiang, Kaohsiung County, TW;
Wei-lun Cheng, Kaohsiung, TW;
Inventors:
Pao-Huei Chang Chien, Kaohsiung County, TW;
Ping-Cheng Hu, Kaohsiung, TW;
Po-Shing Chiang, Kaohsiung County, TW;
Wei-Lun Cheng, Kaohsiung, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
The advanced quad flat non-leaded package structure includes a carrier having a die pad and a plurality of leads, at least a chip, a plurality of wires, and a molding compound. The rough surface of the carrier enhances the adhesion between the carrier and the surrounding molding compound.