Kunshan, China

Wei-Hua Zhang

This inventor holds 2 USPTO granted patents. Top assignees: Foxconn Interconnect Technology Limited, Fu Ding Precision Industrial (Zhengzhou) Co., Ltd., Fuding Precision Industry (Zhengzhou) Co., Ltd.. Active years: 2021-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wei-Hua Zhang. Retrieved from https://idiyas.com/inventor/wei-hua-zhang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.8

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2021-2024

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Wei-Hua Zhang: Pioneering Inventor from Kunshan

Introduction: Wei-Hua Zhang is a distinguished inventor hailing from Kunshan, China, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Zhang's recent patents showcase his expertise in developing cutting-edge solutions for various industries, demonstrating his commitment to pushing the boundaries of technological advancement.

Career Highlights: With a successful career spanning several decades, Wei-Hua Zhang has established himself as a visionary inventor, with a keen eye for identifying gaps in the market and creating innovative solutions to address them.

Collaborations: Throughout his career, Zhang has collaborated with leading companies, research institutions, and universities, fostering a culture of innovation and knowledge-sharing that has led to the development of revolutionary technologies.

Conclusion: Wei-Hua Zhang's relentless pursuit of innovation and his passion for creating solutions that make a difference have solidified his reputation as a trailblazing inventor in the global technological landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…