For the Inventor, By the Inventor

Enter assignee name

Grand Cayman, Cayman Islands

Foxconn Interconnect Technology Limited

USPTO Granted Patents = 1,034

% Expired Patents = 11.4

EPO Patents = 2

Trademarks = 8

Forward Citations = 3,920

Loading Chart...

Loading Chart...

509 inventors (with patents filed for the assignee):

Jun Zhao (128 out of 186 patents)

Jerry Wu (116 out of 504 patents)

Terrance F Little (111 out of 166 patents)

4. Jun Chen (107 out of 151 patents)

5. Jian-Kuang Zhu (61 out of 88 patents)

6. Chih-Pi Cheng (56 out of 86 patents)

7. Fan-Bo Meng (50 out of 66 patents)

8. Shuo-Hsiu Hsu (43 out of 81 patents)

9. Cai-Yun Zhang (39 out of 40 patents)

10. Jing-Jie Guo (39 out of 55 patents)

11. Wei Zhong (32 out of 35 patents)

12. Wen-Jun Tang (31 out of 49 patents)

13. Fang-Jwu Liao (30 out of 98 patents)

14. Xiao Fan (27 out of 30 patents)

15. Kuo-Chun Hsu (26 out of 68 patents)

Core Competencies:

Electrical Connector

Grounding Member

Waterproof Design

Terminal Module

Shielding Plate

Differential Signal

Magnetic Module

Locking Elements

Chip Connector

Contact Assembly

Insulative Housing

Cable Assembly

1,034 patents: Sort by Forward Citations

1. 12771052 - Electrical connector assembly and method of making same (2026-10-20),

2. 12766892 - Positioning system and positioning method of tire pressure sensor and vehicle (2026-10-20),

3. 12763524 - Electrical connector with an improved grounding member (2026-10-13),

4. 12763520 - Electrical connector with floating mechanism (2026-10-13),

5. 12763508 - Electrical connector with improved grounding terminals (2026-10-13),

6. 12763502 - Electrical electrical connector with resisting portions and method of making same (2026-10-13),

7. 12749840 - Contact assembly and method of making same and electrical connector including the contact assembly (2026-09-29),

8. 12731929 - Electrical connector with improved power terminals (2026-09-08),

9. 12725978 - Electrical connector with single grounding bars for suppressing grounding resonance (2026-09-01),

10. 12725962 - Cable connector with improved housing (2026-09-01),

11. 12712316 - ELECTRICAL CONNECTOR HAVING A CAM SLIDE CONTACT LIFTER (2026-08-18),

12. 12712306 - ELECTRICAL CONNECTOR WITH IMPROVED TERMINALS (2026-08-18),

13. 12695226 - Electrical connector with improved protective members (2026-07-28),

14. 12689169 - Electrical connector contact module having a row of contacts with lower level segments offset from soldering tails thereof (2026-07-21),

15. 12683307 - Connecting system and electrical connector for chip module (2026-07-14),

Company Overview

Foxconn Interconnect Technology Limited, headquartered in Grand Cayman, KY, specializes in the development and manufacturing of advanced electrical connectors. The company focuses on innovative solutions in areas such as waterproof design, grounding members, and terminal modules. With expertise in shielding plates and magnetic modules, Foxconn Interconnect Technology is committed to enhancing connectivity and performance across various applications. Its research and development efforts are geared towards creating reliable and efficient products that meet the evolving needs of the electronics industry.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

1,034 Patents

#4 in Grand Cayman

#4 in Cayman Islands

#988 in the World

Grand Cayman, Cayman Islands

Foxconn Interconnect Technology Limited

Forward Citations = 3,920

509 inventors:

Jun Zhao (128 out of 186 patents)

Jerry Wu (116 out of 504 patents)

Terrance F Little (111 out of 166 patents)

4. Jun Chen (107 out of 151 patents)

5. Jian-Kuang Zhu (61 out of 88 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Foxconn Interconnect Technology Limited. Retrieved from https://idiyas.com/company/foxconn-interconnect-technology

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

Loading…