This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Wei-Hsuen Lee: Innovator in Via Accuracy Measurement
Introduction
Wei-Hsuen Lee is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of via accuracy measurement. His innovative work has led to the development of methods and structures that enhance the testing of via accuracy in device components.
Latest Patents
Wei-Hsuen Lee holds 1 patent related to his work. The patent focuses on methods and pad structures designed to test via accuracy. The disclosed method involves forming a first pad and a second pad on a device component, where the second pad includes a via landing area and a clearance opening. The process includes providing a core substrate with a cavity, placing the device component within that cavity, and forming a build-up film over both the device component and the core substrate. Additionally, it describes the formation of a first contact via that extends through the build-up film to contact the landing area, as well as a second contact via that extends through the build-up film and the clearance opening. A continuity test is then performed to determine if the second contact via is in contact with the second pad.
Career Highlights
Wei-Hsuen Lee is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to collaborate with other talented professionals and contribute to cutting-edge technology.
Collaborations
One of his notable coworkers is Hung En Hsu. Their collaboration has likely fostered innovation and advancements in their respective fields.
Conclusion
Wei-Hsuen Lee's contributions to via accuracy measurement demonstrate his commitment to advancing semiconductor technology. His innovative methods and structures are essential for improving the reliability and performance of electronic devices.