Wei-Hsiang Chan

Title: Innovations of Wei-Hsiang Chan

Introduction

Wei-Hsiang Chan is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his expertise and innovative spirit.

Latest Patents

Wei-Hsiang Chan's latest patents include a method for a semiconductor device that features a unique structure. This structure consists of a first conductive feature in a first dielectric layer, with a second dielectric layer positioned over it. A second conductive feature extends through the second dielectric layer to physically contact the first conductive feature. The second conductive feature includes a metal adhesion layer that is in contact with the first conductive feature, a barrier layer along the sidewalls of the second dielectric layer, and a conductive filling material that extends over both the metal adhesion layer and the barrier layer. Notably, a portion of the conductive filling material extends between the barrier layer and the metal adhesion layer.

Career Highlights

Wei-Hsiang Chan is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing semiconductor technologies and improving device performance.

Collaborations

Throughout his career, Wei-Hsiang Chan has collaborated with esteemed colleagues such as Chia-Pang Kuo and Chih-Yi Chang. These collaborations have further enriched his contributions to the field.

Conclusion

Wei-Hsiang Chan's innovative work in semiconductor technology exemplifies his dedication to advancing the industry. His patents reflect a deep understanding of complex structures and methods that enhance device functionality.