This inventor holds 2 USPTO granted patents. Top assignees: Foxconn Technology Co., Ltd., Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.. Active years: 2006-2007.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:


Years Active: 2006-2007
Title: Wei-Guo Zhou: Heat-Dissipation Device Inventor.
Introduction
Wei-Guo Zhou is an inventor associated with Shenzhen, China. His patent work focuses on heat-dissipation devices and the clips used to secure them. He is credited with 2 patents.
Latest Patents
Zhou’s listed patents describe practical approaches to attaching and securing heat sinks.
- **Heat dissipating device.** This design combines a heat sink with a clip. The heat sink has a solid central trunk and fins extending radially outward. A rectangular extension at the trunk’s bottom fits into a corresponding opening in the clip, helping prevent circumferential movement. A pressing portion also bears against the clip along the heat sink’s axis.
- **Heat dissipating device incorporating clip.** This design uses a heat sink placed on a heat-generating unit and two clip members positioned on opposite sides. Each clip member has a movable operating member connected to a fastening member. Moving the operating member from a lower position to an upper position causes the fastening member’s bottom portion to move upward, helping secure the heat sink.
Career Highlights
Zhou is associated with Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. and Foxconn Technology Co., Ltd. His listed inventions address heat-sink positioning and fastening, with an emphasis on clip structures that help hold cooling components in place.
Collaborations
Zhou’s listed coworkers include Gen-Cai Wang and Jin-Liang Wang. Their shared professional context connects them to work involving heat-dissipation devices and related engineering.
Conclusion
Wei-Guo Zhou’s patent portfolio centers on heat-sink attachment and clip mechanisms, reflecting a focused contribution to the design of cooling hardware.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile