Singapore, Singapore

Wei Deng Leong

This inventor holds 1 USPTO granted patent. Top assignee: Micron Technology Incorporated. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wei Deng Leong. Retrieved from https://idiyas.com/inventor/wei-deng-leong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Wei Deng Leong and Semiconductor Memory Circuitry

Introduction

Wei Deng Leong is an inventor associated with Micron Technology Incorporated in Singapore. His patent work concerns integrated circuitry and the fabrication of memory structures.

Latest Patents

Leong is named on 1 patent: “Integrated Circuitry, Memory Circuitry Comprising Strings of Memory Cells, and Methods Used in Forming Integrated Circuitry.” The disclosed method forms a stack of alternating tiers across individual die areas and the scribe-line area between them. It creates a registration mark in the scribe-line area using patterned bars and masking material, then cuts through the registration mark and stack to separate the individual dies. The patent also describes structural embodiments independent of the method.

Career Highlights

Leong’s listed patent reflects work on semiconductor manufacturing processes, particularly registration-mark formation and die separation in memory circuitry. His company, Micron Technology Incorporated, develops memory and storage technologies.

Collaborations

The provided information lists Richard T. Housley and Quinn L. Roberts as Leong’s coworkers. Their specific roles in the patent or related work are not stated.

Conclusion

Wei Deng Leong’s patent documents a semiconductor fabrication approach that integrates registration-mark formation with the preparation and separation of memory-circuitry dies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…