This inventor holds 6 USPTO granted patents and 5 published patent applications. Top assignees: Hon Hai Precision Industry Co., Ltd., Fih (Hong Kong) Limited, Hong-Fu Jin Precision Industry (Shenzhen) Co., Ltd.. Active years: 2006-2020.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:


Years Active: 2006-2020
Title: Wei Deng - Innovator in Electronic Device Housing
Introduction
Wei Deng is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of electronic device housing, holding a total of 6 patents. His innovative designs focus on integrating plastic and metal materials to enhance the durability and functionality of electronic devices.
Latest Patents
Wei Deng's latest patents include groundbreaking technologies in housing for electronic devices. One notable patent describes a housing of plastic that is strongly bonded to a metal frame, which is integrally formed as the housing of an electronic device. This design features a metal frame with at least one plastic grabbing recess that receives a portion of a plastic member. The opening of the plastic grabbing recess carries convex teeth that narrow the opening and lock portions of the plastic member securely in place. Another patent outlines a housing that combines metal and plastic, where the metal frame includes a middle frame portion with an inner surface forming at least one metal rib. The plastic connecting member is formed on one side surface of the metal rib, creating a reinforcing bar that significantly increases the strength of the finished housing.
Career Highlights
Throughout his career, Wei Deng has worked with notable companies such as Hon Hai Precision Industry Co., Ltd. and Hong-Fu Jin Precision Industry (Shenzhen) Co., Ltd. His work in these organizations has allowed him to develop and refine his innovative ideas in electronic device housing.
Collaborations
Wei has collaborated with talented individuals in his field, including Shuo-Hsiu Chang and Kun-Hua Chen. These collaborations have contributed to the advancement of technology in electronic device manufacturing.
Conclusion
Wei Deng is a key figure in the innovation of electronic device housing, with a focus on integrating materials for enhanced performance. His contributions through patents and collaborations continue to shape the future of electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile