Wei Chuan Goh

Title: Innovations by Wei Chuan Goh

Introduction

Wei Chuan Goh is a notable inventor based in Skudai, Malaysia. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on enhancing the performance and reliability of electronic devices through innovative packaging solutions.

Latest Patents

Wei Chuan Goh's latest patents include an air cavity package using high temperature silicone adhesive. This invention features a dielectric frame made from materials such as alumina ceramic, polyimide, or semi-crystalline thermoplastic. The dielectric frame is securely joined to a flange using a high temperature silicone adhesive, with leads bonded to the frame through various methods. Another significant patent is for copper flanged air cavity packages for high frequency devices. This design incorporates a flange and a pedestal that extends upward from the flange, allowing for a more efficient connection between the semiconductor die and the leads.

Career Highlights

Wei Chuan Goh is currently employed at Materion GmbH, where he continues to develop innovative solutions in semiconductor packaging. His expertise in high temperature adhesives and dielectric materials has positioned him as a key player in the industry.

Collaborations

Throughout his career, Wei Chuan Goh has collaborated with esteemed colleagues such as Richard J Koba and Chee Kong Lee. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Wei Chuan Goh's contributions to semiconductor packaging through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the electronics industry positively.