The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2022
Filed:
May. 09, 2017
Applicant:
Materion Corporation, Mayfield Heights, OH (US);
Inventors:
Richard J. Koba, Saugus, MA (US);
Chee Kong Lee, Euro Asia Park, SG;
Wei Chuan Goh, Skudai, MY;
Sin Yee Chin, Singapore, SG;
Assignee:
Materion Corporation, Mayfield Heights, OH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/14 (2006.01); H01L 23/047 (2006.01); H01L 23/04 (2006.01); H01L 23/10 (2006.01); H01L 23/28 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/14 (2013.01); H01L 23/04 (2013.01); H01L 23/047 (2013.01); H01L 23/10 (2013.01); H01L 23/28 (2013.01); H01L 23/36 (2013.01); H01L 23/3738 (2013.01);
Abstract
An air cavity package includes a dielectric frame that is formed from an alumina ceramic, a polyimide, or a semi-crystalline thermoplastic. The dielectric frame is joined to a flange using a high temperature silicone adhesive. Leads may be bonded to the dielectric frame using a high temperature organic adhesive, a direct bond, or by brazing.