Company Filing History:
Years Active: 2018-2022
Title: Sin Yee Chin: Innovator in Air Cavity Package Technology
Introduction
Sin Yee Chin is a prominent inventor based in Singapore, SG. She has made significant contributions to the field of semiconductor packaging technology. With a total of 2 patents, her work focuses on enhancing the performance and reliability of air cavity packages.
Latest Patents
Her latest patents include innovative designs that utilize high-temperature silicone adhesive. The first patent, titled "Air cavity package using high temperature silicone adhesive," describes an air cavity package that features a dielectric frame made from alumina ceramic, polyimide, or semi-crystalline thermoplastic. This dielectric frame is securely joined to a flange using a high-temperature silicone adhesive. Additionally, leads can be bonded to the dielectric frame through various methods, including high-temperature organic adhesive, direct bonding, or brazing.
The second patent, "Copper flanged air cavity packages for high frequency devices," outlines a design that includes a flange and a pedestal extending upward from the flange. The dielectric frame surrounds the pedestal, and the semiconductor die is placed on the pedestal, which minimizes the length of the wires connecting the die to the leads of the air cavity package.
Career Highlights
Sin Yee Chin is currently employed at Materion GmbH, where she continues to innovate in the field of semiconductor packaging. Her expertise and dedication to her work have positioned her as a key player in her industry.
Collaborations
Throughout her career, she has collaborated with notable colleagues, including Richard J Koba and Chee Kong Lee. These partnerships have further enhanced her contributions to the field.
Conclusion
Sin Yee Chin's innovative work in air cavity package technology demonstrates her commitment to advancing semiconductor packaging solutions. Her patents reflect her expertise and the impact she has made in her field.