The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
May. 18, 2017
Applicant:
Materion Corporation, Mayfield Heights, OH (US);
Inventors:
Richard J. Koba, Saugus, MA (US);
Chee Kong Lee, Euro Asia Park, SG;
Wei Chuan Goh, Skudai, MY;
Sin Yee Chin, Singapore, SG;
Assignee:
MATERION CORPORATION, Mayfield Heights, OH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 21/48 (2006.01); H01L 23/047 (2006.01); H01L 21/52 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); H01L 21/4803 (2013.01); H01L 21/52 (2013.01); H01L 23/047 (2013.01);
Abstract
An air cavity package includes a flange and a pedestal extending upward from the flange. A dielectric frame is joined to the flange and surrounds the pedestal. The semiconductor die is placed on the pedestal, which reduces the length of the wires joining the die to the leads of the air cavity package.