Kirkland, WA, United States of America

Warren M Jensen

This inventor holds 2 USPTO granted patents. Top assignees: Boeing Aerospace Co., The Boeing Company. Active years: 1982-1986.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Warren M Jensen. Retrieved from https://idiyas.com/inventor/warren-m-jensen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.3

ph-index = 2

Forward Citations = 78(Granted Patents)


Company Filing History:


Years Active: 1982-1986

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2 patents (USPTO):Explore Patents

Title: Warren M Jensen: Innovator in Printed Wiring Board Technology

Introduction

Warren M Jensen is a notable inventor based in Kirkland, WA (US). He has made significant contributions to the field of printed wiring board technology, holding two patents that showcase his innovative approach to enhancing thermal conductivity and structural integrity in electronic components.

Latest Patents

Warren's latest patents include a thermally conductive printed wiring board laminate and printed wiring board substrates for ceramic chip carriers. The first patent describes a laminate that is particularly suitable for leadless surface mounted devices, combining a low coefficient of thermal expansion in the X-Y direction with thermal conductivity. This laminate features a support made from graphite fiber reinforced metal, which is adhesively secured to a dielectric fiber reinforced resin printed wiring board. The second patent presents a composite printed wiring board that utilizes conventional fiber reinforced plastic laminates secured to a support member made from graphite filament reinforced thermoset resin. This innovative design significantly reduces the apparent coefficient of thermal expansion of the printed wiring board, making it more compatible with ceramic chip carriers.

Career Highlights

Warren has had a distinguished career, working with prominent companies such as Boeing Aerospace Co. and The Boeing Company. His experience in these organizations has allowed him to apply his inventive skills to real-world applications, contributing to advancements in aerospace technology.

Collaborations

Warren has collaborated with various professionals in his field, including his coworker William C Wilkinson. These collaborations have likely fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.

Conclusion

Warren M Jensen's contributions to printed wiring board technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of materials and engineering principles, positioning him as a key figure in the advancement of electronic component design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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