The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 1982
Filed:
Feb. 09, 1981
Warren M Jensen, Kirkland, WA (US);
Boeing Aerospace Company, Seattle, WA (US);
Abstract
A composite printed wiring board is provided wherein the surface of the board is fabricated from conventional fiber reinforced plastic laminates such as glass fiber reinforced epoxy laminates and that laminate is secured by means of a thermoset adhesive to a support member which is fabricated from graphite filament reinforced thermoset resin having a low coefficient of thermal expansion approaching zero. The unrestrained coefficient of thermal expansion of the printed wiring board is significantly greater than that of the support member. However, in the composite assembly, the apparent coefficient of thermal expansion of the printed wiring board is greatly reduced and can approximate the coefficient of thermal expansion of a ceramic chip carrier. The coefficient of thermal expansion of the printed wiring board in its thickness direction is only slightly reduced in the composite assembly.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile