Foshan, China

Wanying Zou

This inventor holds 1 USPTO granted patent. Top assignee: Foshan University. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wanying Zou. Retrieved from https://idiyas.com/inventor/wanying-zou

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Wanying Zou: Innovator in Conductive Paste Technology

Introduction

Wanying Zou is a notable inventor based in Foshan, China. He has made significant contributions to the field of packaging interface materials for electronic power devices. His innovative work focuses on developing a silver-copper composite conductive paste that can be sintered at low temperatures.

Latest Patents

Wanying Zou holds a patent for a silver-copper composite conductive paste capable of being sintered at low temperature. This invention includes components such as 20-80% micro-copper particles, 10-60% nano-silver sheets, 1-20% nano-silver particles, and 10% of an organic carrier. The unique combination of different sizes and morphologies of silver and copper enhances the performance of the conductive paste by reducing gaps.

Career Highlights

Wanying Zou is affiliated with Foshan University, where he continues to advance research in conductive materials. His work has implications for improving the efficiency and reliability of electronic devices.

Collaborations

Wanying Zou collaborates with colleagues such as Haiying He and Li Hu, contributing to a dynamic research environment focused on innovative materials.

Conclusion

Wanying Zou's contributions to the field of conductive paste technology exemplify the importance of innovation in electronic materials. His work not only enhances the performance of electronic devices but also paves the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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