The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2025
Filed:
Jan. 17, 2025
Foshan University, Foshan, CN;
Haiying He, Shenzhen, CN;
Li Hu, Chengdu, CN;
Zhihao Yang, East Brunswick, NJ (US);
Wanying Zou, Foshan, CN;
Jianzhang Lv, Guangzhou, CN;
Foshan University, Foshan, CN;
Abstract
The invention belongs to the technical field of packaging interface materials for electronic power devices, and particularly discloses a silver-copper composite conductive paste capable of being sintered at a low temperature, and a preparation method and use thereof. A first purpose of the invention is to provide a silver-copper composite conductive paste capable of being sintered at a low temperature, comprising, by weight, the following components: 20-80% of micro-copper particles; 10-60% of nano-silver sheets; 1-20% of nano-silver particles; and 10% of an organic carrier. The silver-copper composite conductive paste capable of being sintered at a low temperature provided by the invention adopts silver and copper of different sizes and morphologies, large-sized sliver sheets and micro-copper particles are used as skeletons, and small nano-silver particles are used for filling, such that gaps are reduced, and the performance is improved.