Beijing, China

Wanshuang Liu


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2023-2024

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2 patents (USPTO):

Title: Wanshuang Liu: Innovator in Conductive Adhesive Technology

Introduction

Wanshuang Liu is a prominent inventor based in Beijing, China. He has made significant contributions to the field of conductive adhesive technology, holding a total of 2 patents. His innovative work focuses on developing environmentally friendly and efficient adhesive solutions for various applications.

Latest Patents

Wanshuang Liu's latest patents include a composition for a low halogen and fast curing conductive adhesive and its preparation method. This invention features a unique combination of raw materials, including epoxy resin, curing agents, and conductive silver filler. The adhesive boasts advantages such as rapid curing within 10 minutes, low halogen content, high bond strength, and excellent moisture-heat aging resistance. It is particularly suitable for microelectronic packaging applications.

Another notable patent is for a recyclable conductive adhesive composition for LED packaging. This invention not only provides a method for preparing the adhesive but also outlines a recycling method for the conductive silver powder used in the adhesive. The incorporation of dynamic imine chemical bonds allows for the degradation and recycling of the adhesive, promoting sustainability in electronic packaging.

Career Highlights

Wanshuang Liu has worked with several companies, including Blue Ocean & Black Stone Technology Co., Ltd. and Fujian Blue Ocean & Black Stone Technology Co., Ltd. His experience in these organizations has contributed to his expertise in adhesive technology and innovation.

Collaborations

Wanshuang Liu has collaborated with notable colleagues such as Hebin Luo and Yi Wei. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and advancements in adhesive technology.

Conclusion

Wanshuang Liu is a dedicated inventor whose work in conductive adhesive technology has the potential to revolutionize the industry. His innovative patents reflect a commitment to sustainability and efficiency, making significant strides in the field of microelectronics and LED packaging.

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