The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2024

Filed:

Jul. 21, 2020
Applicant:

Blue Ocean & Black Stone Technology Co., Ltd. (Beijing), Beijing, CN;

Inventors:

Wanshuang Liu, Beijing, CN;

Hebin Luo, Beijing, CN;

Yi Wei, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); C09J 9/02 (2006.01); C09J 4/06 (2006.01); C08K 3/08 (2006.01); C08K 7/18 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C09J 4/06 (2013.01); C09J 9/02 (2013.01); C08K 3/08 (2013.01); C08K 7/18 (2013.01); C08K 2003/0806 (2013.01); C08K 2201/005 (2013.01); C08K 2201/011 (2013.01);
Abstract

The present invention refers to a composition, a low halogen and fast curing conductive adhesive and its preparation method. The composition includes the following raw materials measured by weight: epoxy resin 5-15 parts, curing agent 0.5-3 parts, acrylic acid component 5-12 parts, initiator 0.5-2 parts, flexibilizer 2-5 parts, wetting dispersant 0.1-1 parts, coupling agent 0.1-1 parts, antioxidant 0.1-1 parts, defoamer 0.1-1 parts and conductive silver filler 75-85 parts. The low halogen and fast curing conductive adhesive of the present invention has the advantages of fast curing (within 10 min), low halogen content, high bond strength, good moisture-heat aging resistance, good electric conductivity and thermal conductivity and so on, and has wide application prospects in the field of microelectronic packaging.


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