Beijing, China

Hebin Luo


 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2023-2024

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2 patents (USPTO):

Title: Hebin Luo: Innovator in Conductive Adhesive Technology

Introduction

Hebin Luo is a prominent inventor based in Beijing, China, known for his contributions to the field of conductive adhesive technology. With a focus on developing innovative materials, he has secured a total of 2 patents that enhance the performance and sustainability of adhesive products.

Latest Patents

Hebin Luo's latest patents include a composition for a low halogen and fast curing conductive adhesive and its preparation method. This invention features a unique formulation that includes epoxy resin, curing agents, and conductive silver filler, allowing for rapid curing within 10 minutes. The adhesive boasts low halogen content, high bond strength, and excellent moisture-heat aging resistance, making it suitable for microelectronic packaging applications.

Another significant patent is for a recyclable conductive adhesive composition for LED packaging. This invention not only provides a method for preparing the adhesive but also outlines a recycling method for the conductive silver powder used in the adhesive. The incorporation of an epoxy curing agent containing imine bonds allows for the dynamic exchange reaction, enabling the recycling and reuse of conductive materials.

Career Highlights

Hebin Luo has worked with notable companies such as Blue Ocean & Black Stone Technology Co., Ltd. and Fujian Blue Ocean & Black Stone Technology Co., Ltd. His experience in these organizations has contributed to his expertise in adhesive technologies and material science.

Collaborations

Hebin has collaborated with talented individuals in his field, including Wanshuang Liu and Yi Wei. These partnerships have fostered innovation and development in his projects.

Conclusion

Hebin Luo's work in conductive adhesive technology showcases his commitment to innovation and sustainability. His patents reflect a significant advancement in the field, promising to impact various applications in microelectronics and LED packaging.

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