Goyang, South Korea

WanJong Kim

This inventor holds 4 USPTO granted patents. Top assignee: Amkor Technology, Inc.. Active years: 2010-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: WanJong Kim. Retrieved from https://idiyas.com/inventor/wanjong-kim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 32(Granted Patents)


Company Filing History:


Years Active: 2010-2012

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4 patents (USPTO):Explore Patents

Title: The Innovative Contributions of WanJong Kim

Introduction

WanJong Kim is a notable inventor based in Goyang-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing the design and functionality of semiconductor packages, which are crucial components in modern electronic devices.

Latest Patents

Among his latest patents is the "Fusion quad flat semiconductor package." This innovative semiconductor package features a generally planar die paddle that defines multiple peripheral edge segments and a plurality of leads segregated into at least two concentric rows. The design allows for at least one semiconductor die to be electrically connected to some of the leads in each row. The package body encapsulates portions of the die paddle, leads, and semiconductor die, with the bottom surfaces of the die paddle and leads being exposed in a common exterior surface of the package body.

Another significant patent is the "Semiconductor device including leadframe with increased I/O." This invention presents a uniquely configured leadframe designed to maximize the number of exposed leads in a semiconductor package, such as a QFP package. The semiconductor package includes a generally planar die pad that defines multiple peripheral edge segments and a plurality of leads. Some leads feature exposed bottom surface portions arranged in a row or ring that partially circumvents the die pad, while others protrude from the package body. This design enhances the electrical connectivity and efficiency of the semiconductor device.

Career Highlights

WanJong Kim is currently employed at Amkor Technology, Inc., a leading provider of semiconductor packaging and test services. His work at Amkor has allowed him to contribute to cutting-edge advancements in semiconductor technology, further establishing his reputation as an innovative inventor in the industry.

Collaborations

Throughout his career, WanJong Kim has collaborated with talented individuals such as GiJeong Kim and YeonHo Choi. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies in the semiconductor field.

Conclusion

WanJong Kim's contributions to semiconductor technology through his innovative patents and collaborations highlight his significant role in advancing the industry. His work continues to impact the design and functionality of electronic devices, showcasing the importance of innovation in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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