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For the Inventor, By the Inventor

Singapore, Singapore

Wang Zhe

USPTO Granted Patents = 12

Average Co-Inventor Count = 1.7

ph-index = 9

Forward Citations = 394(Granted Patents)


Location History:

  • Singpore, SG (2011)
  • Singapore, SG (2007 - 2013)

Company Filing History:

goldMedal7 out of 10 
 
Shandong Gettop Acoustic Co., Ltd.
 patents
silverMedal5 out of 5 
 
Silicon Matrix Pte Ltd.
 patents

Years Active: 2007-2013

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12 patents (USPTO):Explore Patents
1. 8467559 - Silicon microphone without dedicated backplate (2013-06-18),
2. 8178936 - Double-side mountable MEMS package (2012-05-15),
3. 8045734 - Backplateless silicon microphone (2011-10-25),
4. 8045733 - Silicon microphone with enhanced impact proof structure using bonding wires (2011-10-25),
5. 8013404 - Folded lead-frame packages for MEMS devices (2011-09-06),
6. 7999201 - MEMS G-switch device (2011-08-16),
7. 7843021 - Double-side mountable MEMS package (2010-11-30),
8. 7692288 - MEMS packaging method for enhanced EMI immunity using flexible substrates (2010-04-06),
9. 7436054 - MEMS microphone with a stacked PCB package and method of producing the same (2008-10-14),
10. 7346178 - Backplateless silicon microphone (2008-03-18),
11. 7329933 - Silicon microphone with softly constrained diaphragm (2008-02-12),
12. 7202552 - MEMS package using flexible substrates, and method thereof (2007-04-10),

Title: The Innovative Contributions of Wang Zhe

Introduction

Wang Zhe is a prominent inventor based in Singapore, known for his significant contributions to the field of acoustic technology. With a total of 12 patents to his name, he has made remarkable advancements in microphone design and MEMS packaging.

Latest Patents

Wang Zhe's latest patents include a silicon microphone without a dedicated backplate. This invention features a microphone sensing element with a diaphragm that can be circular or polygonal, supported by perforated springs above a conductive substrate. The design allows for integration with CMOS devices on a single chip, enhancing its functionality. Another notable patent is the double-side mountable MEMS package, which includes a mounting substrate with transducer chips and a unique housing structure. This design facilitates electrical connections and offers flexibility in attachment to printed circuit boards.

Career Highlights

Throughout his career, Wang Zhe has worked with notable companies such as Shandong Gettop Acoustic Co., Ltd. and Silicon Matrix Pte Ltd. His work has significantly impacted the development of advanced acoustic technologies, showcasing his expertise and innovative spirit.

Collaborations

Wang Zhe has collaborated with talented individuals in the field, including Miao Yubo and Chong Ser Choong. These partnerships have contributed to the successful development of his inventions and patents.

Conclusion

Wang Zhe's innovative contributions to acoustic technology and MEMS packaging demonstrate his commitment to advancing the field. His patents reflect a deep understanding of engineering principles and a drive for innovation.

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