The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
Oct. 09, 2008
Wang Zhe, Singapore, SG;
Chong Ser Choong, Singapore, SG;
Wang Zhe, Singapore, SG;
Chong Ser Choong, Singapore, SG;
Shandong Gettop Acoustic Co. Ltd., Shandong, CN;
Abstract
The MEMS package comprises a first and a second pre-molded lead-frame substrate, at least one of them having a cavity formed by plastic sidewalls along its periphery. The first and second pre-molded lead-frame substrates are interconnected with metal leads. At least one MEMS device is attached to one of the substrates. The first pre-molded lead-frame substrate is folded over and joined to the second pre-molded lead-frame substrate to house the at least one MEMS device. In one embodiment, the first pre-molded lead-frame substrate has metal leads extending outside of sidewalls of the cavities. The extended metal leads are folded over the top of the second pre-molded lead-frame substrate to form surface mounting pads. In some embodiments, extended metal leads are folded along the sidewalls and connected to ground for electromagnetic interference (EMI) shielding.