Chong Ser Choong

Title: Innovations of Chong Ser Choong

Introduction

Chong Ser Choong is a notable inventor based in Singapore, recognized for his contributions to the field of acoustic technology. With a total of four patents to his name, he has made significant advancements in the design and functionality of MEMS (Micro-Electro-Mechanical Systems) packages and silicon microphones.

Latest Patents

Chong's latest patents include a double-side mountable MEMS package. This innovative design features a mounting substrate with an opening, allowing for the attachment of one or more transducer chips. The package is enclosed by a top cover, a spacer, and the mounting substrate, with electrical connections made between the chips and the substrate or top cover. Additionally, a bottom cover can be mounted to form a hollow chamber, enhancing the overall functionality of the device.

Another significant patent is for a silicon microphone with an enhanced impact-proof structure using bonding wires. This design incorporates a backplateless silicon microphone suspended over a backside hole in the substrate. The circular diaphragm is surrounded by a circular spring, which allows for improved flexibility and air damping. The innovative use of bonding wires serves to restrict the upward motion of the diaphragm, providing greater resistance to impact.

Career Highlights

Chong Ser Choong is currently employed at Shandong Gettop Acoustic Co., Ltd., where he continues to develop cutting-edge acoustic technologies. His work has garnered attention for its practical applications and innovative designs, contributing to advancements in the field.

Collaborations

Chong collaborates with Wang Zhe, a fellow innovator in the industry. Their partnership has led to the development of several impactful technologies that enhance the performance of acoustic devices.

Conclusion

Chong Ser Choong's contributions to the field of acoustic technology through his patents and innovative designs highlight his role as a leading inventor. His work continues to influence advancements in MEMS packages and silicon microphones, showcasing the importance of innovation in technology.