This inventor holds 2 USPTO granted patents. Top assignee: Micron Technology Incorporated. Active years: 2011-2013.
Company Filing History:
Years Active: 2011-2013
Title: Innovations of Wang Ai-Chie in Semiconductor Technology
Introduction
Wang Ai-Chie is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. He holds 2 patents that showcase his innovative approaches in the field. His work primarily focuses on methods of forming and assembling pre-encapsulated assemblies, which are crucial for the development of advanced semiconductor devices.
Latest Patents
Wang Ai-Chie's latest patents include "Methods of forming and assembling pre-encapsulated assemblies and of forming associated semiconductor device packages." This patent describes methods for forming pre-encapsulated frames by flowing a dielectric encapsulation material around at least one conductive trace. A cavity is created within the encapsulation material to receive at least one semiconductor device. The design ensures that a first connection area of the trace is exposed within the cavity, while another connection area is exposed laterally adjacent to it. The dielectric encapsulation material is then hardened to form a pre-encapsulated frame. Another significant patent is the "Pre-encapsulated cavity interposer," which serves as a pre-encapsulated frame for semiconductor devices.
Career Highlights
Wang Ai-Chie is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His work at Micron has allowed him to push the boundaries of semiconductor packaging technology, contributing to the efficiency and performance of electronic devices.
Collaborations
Wang collaborates with his coworker, Tay Wuu Yean, to further enhance the innovations in their field. Their teamwork exemplifies the importance of collaboration in driving technological advancements.
Conclusion
Wang Ai-Chie's contributions to semiconductor technology through his patents and work at Micron Technology Incorporated highlight his role as an influential inventor in the industry. His innovative methods are paving the way for future advancements in semiconductor device packaging.