This inventor holds 2 USPTO granted patents. Top assignees: Laird Technologies Gmbh, Te Connectivity Services Gmbh, Tyco Electronics (Shanghai) Co., Ltd.. Active years: 2013-2022.
Company Filing History:
1 out of 287 
1 out of 183 
1 out of 530 
Years Active: 2013-2022
Title: The Innovations of Wanfa Su
Introduction
Wanfa Su is a notable inventor based in Shanghai, China. He has made significant contributions to the field of electrical connectors and shielding enclosures. With a total of 2 patents, his work showcases innovative designs that enhance the functionality and reliability of electronic components.
Latest Patents
Wanfa Su's latest patents include a surface mount electrical connector and various exemplary embodiments of shielding enclosures. The surface mount electrical connector features a housing with contact chambers designed for mounting to a circuit board. It includes a rear wall with lead slots for receiving leads of electrical components, ensuring a secure electrical connection. The shielding enclosure, on the other hand, consists of a frame and a lid, designed to protect electronic components from external interference. The frame has vertically extending sidewalls and lateral flanges, while the lid includes a detent structure for secure installation.
Career Highlights
Throughout his career, Wanfa Su has worked with prominent companies such as Te Connectivity Services GmbH and Tyco Electronics (Shanghai) Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to the development of innovative technologies in the electronics industry.
Collaborations
Wanfa Su has collaborated with notable professionals in his field, including Christopher P. Devine and Hua Li. These collaborations have further enriched his work and expanded his impact on the industry.
Conclusion
Wanfa Su's contributions to the field of electrical connectors and shielding enclosures demonstrate his innovative spirit and dedication to advancing technology. His patents reflect a commitment to improving the functionality and reliability of electronic components.