Company Filing History:
Years Active: 2009-2010
Title: Innovations by Wan-Jung Hsieh
Introduction
Wan-Jung Hsieh is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of three patents. His work focuses on enhancing the efficiency and reliability of semiconductor devices.
Latest Patents
Wan-Jung Hsieh's latest patents include innovative designs that improve leadframes and semiconductor packages. One of his patents describes a leadframe with downset baffle paddles, which features a unique internal tie bar designed to reduce shifting and twisting during the manufacturing process. This design enhances the stability of the semiconductor package. Another patent details a leadframe-based semiconductor package that incorporates an arched bend in a supporting bar. This design effectively absorbs pulling stresses and prevents cracks caused by delamination, thereby ensuring the integrity of the semiconductor package.
Career Highlights
Wan-Jung Hsieh is currently employed at Powertech Technology Inc., a leading company in the semiconductor industry. His work has been instrumental in advancing the technology used in semiconductor packaging, contributing to the overall efficiency and performance of electronic devices.
Collaborations
Throughout his career, Wan-Jung Hsieh has collaborated with talented individuals such as Chin-Fa Wang and Yu-Mei Hsu. These collaborations have fostered innovation and have led to the development of cutting-edge technologies in the semiconductor field.
Conclusion
Wan-Jung Hsieh's contributions to semiconductor packaging through his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to impact the industry positively, making him a significant figure in the field of inventions.