Powertech Technology Inc.

Wan-Jung Hsieh

Chin-Fa Wang

Yu-Mei Hsu

Chin-Ti Chen

Bing-Shun Yu

A lead frame with downset baffle paddles and a semiconductor package utilizing the same are revealed. The lead frame primarily comprises a plurality of leads formed on a first plane, a baffle paddle formed on a second plane in parallel, and an internal tie bar formed between the first plane and the second plane. The internal tie bar has at least two or more windings such as 'S' shaped to flexibly connect the baffle paddle to an adjacent one of the leads. Therefore, the internal tie bar can reduce the shifting and twisting of the connected lead during the formation of the downset of the baffle paddle.

Leadframe and semiconductor package having downset baffle paddles

A leadframe-based semiconductor package and a leadframe for the package are revealed. The semiconductor package primarily includes parts of the leadframe including one or more first leads, one or more second leads, and a supporting bar disposed between the first leads and the second leads and further includes a chip attached to the first leads, the second leads and the supporting bar, a plurality of bonding wires and an encapsulant. The supporting bar has an extended portion projecting from the first bonding finger and the second bonding finger and connected to a non-lead side of the encapsulant wherein the extended portion has an arched bend to absorb the pulling stresses and to block stress transmission. Cracks caused by delamination of the supporting bar will not be created during trimming the supporting bar along the non-lead side of the encapsulant. Moisture penetration along the cracks of the supporting bar to the die-bonding plane under the chip is desirably prevented.

Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package

A semiconductor package primarily comprises a plurality of leadframe's leads, a chip, a paddle, an adhesive and an encapsulant encapsulating the components mentioned above. The paddle has a carrying surface and an exposed external surface. The first chip is attached to one surface of the leads. The paddle is attached to an opposing surface of the leads by the adhesive bonding the carrying surface to the leads. Furthermore, the adhesive further encapsulates the gaps between the leads without contaminating the exposed external surface and with the exposed external surface exposed from the encapsulant. Therefore, the leads obtain a better support so that the encapsulated portions of the leads will not shift nor expose from the encapsulant during molding processes without encapsulated bubbles between the leads and the paddle. The heat dissipation is also enhanced.

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Hsinchu, Taiwan

Wan-Jung Hsieh