Hsinchu, Taiwan

Wan-Fang Shih

This inventor holds 1 USPTO granted patent. Top assignee: Tyntek Corporation. Active years: 2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wan-Fang Shih. Retrieved from https://idiyas.com/inventor/wan-fang-shih

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Wan-Fang Shih

Introduction

Wan-Fang Shih is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of light-emitting diode (LED) packaging technology. His innovative designs have paved the way for advancements in the efficiency and reliability of LED applications.

Latest Patents

Wan-Fang Shih holds a patent for a "Submount-holder for flip chip package." This invention includes a substrate on which a body is formed. The submount body defines a cavity sized and shaped to snugly receive an LED die therein. The cavity precisely retains the die in position and prevents arbitrary movement during the packaging and wiring process. First and second connection sections are formed on opposite sides of the cavity and are connected to the cavity by a channel. A conductive layer is formed on the substrate in the cavity, the first and second connection sections, and the channels connecting the connection sections and the cavity. A groove is defined in the body and extends through the cavity, with the connection sections located on opposite sides of the groove. The conductive layer is divided by the groove into separated and isolated portions. The die is received in the cavity with positive and negative terminals engaging the conductive layers of the first and second connection sections. The first and second connection sections allow for ready connection of wires for the wiring process of the package. Wan-Fang Shih has 1 patent to his name.

Career Highlights

Wan-Fang Shih is currently employed at Tyntek Corporation, where he continues to innovate in the field of LED technology. His work has been instrumental in enhancing the performance and reliability of LED products.

Collaborations

He has collaborated with notable colleagues such as Chi-Jen Teng and Zhi-Ping He, contributing to various projects that aim to advance LED packaging technologies.

Conclusion

Wan-Fang Shih's contributions to the field of LED technology through his innovative patent demonstrate his commitment to advancing the industry. His work continues to influence the development of efficient and reliable LED applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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