The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2004
Filed:
Apr. 22, 2003
Chi-Jen Teng, Hsinchu, TW;
Wan-Fang Shih, Hsinchu, TW;
Zhi-Ping He, Taipei, TW;
Cheng-Wei Ko, Feng-Yuan, TW;
Tyntek Corporation, Hsinchu, TW;
Abstract
A submount holder for flip chip packaging of light emitting diode (LED) includes a substrate on which a body is formed. The submount body defines a cavity sized and shaped to snugly receive an LED die therein. The cavity precisely retains the die in position and prevents the die from arbitrary movement during a packaging and wiring process. First and second connection sections are formed on opposite sides of the cavity and respectively connected to the cavity by a channel. A conductively layer is formed on the substrate in the cavity, the first and second connection sections and the channels connecting the connection sections and the cavity. A groove is defined in the body and extends through the cavity with the connection sections located on opposite sides of the groove. The conductive layer is divided by the groove into separated and isolated portions. The die is received in the cavity with positive and negative terminals thereof respectively engaging the conductive layers of the first and second connection sections. The first and second connection sections allow for ready connection of wires thereto for a wiring process of the package.