Company Filing History:
Years Active: 2004
Title: Cheng-Wei Ko: Innovator in LED Packaging Technology
Introduction
Cheng-Wei Ko is a notable inventor based in Feng-Yuan, Taiwan. He has made significant contributions to the field of light-emitting diode (LED) packaging technology. His innovative designs have paved the way for advancements in the efficiency and reliability of LED applications.
Latest Patents
Cheng-Wei Ko holds a patent for a submount holder for flip chip packaging of LEDs. This invention includes a substrate on which a body is formed. The submount body defines a cavity sized and shaped to snugly receive an LED die. This design precisely retains the die in position and prevents arbitrary movement during the packaging and wiring process. The patent also features first and second connection sections formed on opposite sides of the cavity, which are connected to the cavity by a channel. A conductive layer is formed on the substrate in the cavity, the connection sections, and the channels. The groove defined in the body extends through the cavity, with the connection sections located on opposite sides of the groove. The conductive layer is divided by the groove into separated and isolated portions. The die is received in the cavity with its positive and negative terminals engaging the conductive layers of the connection sections. This design allows for easy connection of wires during the wiring process of the package.
Career Highlights
Cheng-Wei Ko is associated with Tyntek Corporation, where he continues to innovate in the field of LED technology. His work has been instrumental in enhancing the performance and reliability of LED products.
Collaborations
Cheng-Wei Ko has collaborated with notable coworkers such as Chi-Jen Teng and Wan-Fang Shih. Their combined expertise has contributed to the success of various projects within the company.
Conclusion
Cheng-Wei Ko's contributions to LED packaging technology demonstrate his commitment to innovation and excellence. His patent for the submount holder showcases his ability to solve complex engineering challenges. His work continues to influence the industry and improve LED applications.