Wai Mun Chong

Title: Wai Mun Chong - Innovator in Semiconductor Structures

Introduction

Wai Mun Chong is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. He holds a patent that showcases his innovative approach to seal ring bonding structures, which are essential in the manufacturing of semiconductor devices.

Latest Patents

Wai Mun Chong's patent, titled "Seal ring bonding structures," focuses on semiconductor structures, particularly seal ring structures with channels and methods of manufacture. The invention includes a first wafer with a channel formed within a passivation layer, and a second wafer featuring a protuberance that can be inserted into the channel. This protuberance is bonded to the first wafer using eutectic bonding materials. Additionally, the structure incorporates a plurality of stoppers or tabs within the channel, creating a gap that is smaller than gaps found in other portions of the channel.

Career Highlights

Wai Mun Chong is currently employed at Vanguard International Semiconductor Singapore Pte. Ltd., where he applies his expertise in semiconductor manufacturing. His work has significantly contributed to advancements in the field, particularly in the area of bonding structures.

Collaborations

Wai Mun Chong collaborates with talented professionals such as Lieneng Low and Teck Wee Christopher Lim, enhancing the innovative capabilities of his team.

Conclusion

Wai Mun Chong's contributions to semiconductor technology through his patent on seal ring bonding structures exemplify his role as an innovator in the field. His work continues to influence advancements in semiconductor manufacturing.