The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Jun. 12, 2018
Applicant:

Vanguard International Semiconductor Singapore Pte. Ltd., Singapore, SG;

Inventors:

Lieneng Low, Singapore, SG;

Teck Wee Christopher Lim, Singapore, SG;

Wai Mun Chong, Singapore, SG;

Wan Tak Ng, Selangor, MY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 23/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); B81B 7/0074 (2013.01); H01L 24/29 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/26145 (2013.01); H01L 2224/29124 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01322 (2013.01);
Abstract

The present disclosure relates to semiconductor structures and, more particularly, to seal ring structures with channels and methods of manufacture. The structure includes: a first wafer having a channel formed within a passivation layer; a second wafer having a protuberance which is insertable into the channel and which is bonded to the first wafer with eutectic bonding materials; and a plurality of stoppers or tabs extending within the channel and which provides a gap that has a dimension smaller than a gap formed in other portions of the channel.


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