Vanguard International Semiconductor Singapore Pte. Ltd.

Wai Mun Chong

Lieneng Low

Teck Wee Christopher Lim

Wan Tak Ng

The present disclosure relates to semiconductor structures and, more particularly, to seal ring structures with channels and methods of manufacture. The structure includes: a first wafer having a channel formed within a passivation layer; a second wafer having a protuberance which is insertable into the channel and which is bonded to the first wafer with eutectic bonding materials; and a plurality of stoppers or tabs extending within the channel and which provides a gap that has a dimension smaller than a gap formed in other portions of the channel.

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Singapore, Singapore

Wai Mun Chong