Hyde Park, NY, United States of America

Wade H White

USPTO Granted Patents = 17 

Average Co-Inventor Count = 3.6

ph-index = 8

Forward Citations = 203(Granted Patents)


Company Filing History:


Years Active: 1997-2018

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17 patents (USPTO):

Title: Innovations of Wade H. White: A Pioneer in Electronic Assembly Technologies

Introduction

Wade H. White, an accomplished inventor based in Hyde Park, NY, has made significant contributions to the field of electronic assembly technologies. With a total of 17 patents to his name, Wade has established himself as a noteworthy figure in innovation, particularly in the design and functionality of computing device structures.

Latest Patents

Among Wade's notable inventions, two recent patents demonstrate his ingenuity and technical expertise. The first is a "Screw Attachment System for Electronic Assemblies," which describes an apparatus for mating computing device structures. This innovative apparatus comprises a first bracket that is coupled to a pluggable electronic device and features attachment capabilities for seamless integration with supporting structures. Additionally, it incorporates guide tubes to enhance efficiency and stability.

His second recent patent, the "Latch and Spring Assembly," details an apparatus for effectively mating computing device structures using rotatable latches. Each latch is equipped with a screw mechanism, while the apparatus also includes spring assemblies with threading that accommodates the corresponding screw mechanisms. These inventions reflect Wade's commitment to improving the functionality and reliability of electronic devices.

Career Highlights

Wade H. White is currently employed at the prestigious International Business Machines Corporation (IBM). His role at IBM has afforded him the opportunity to develop groundbreaking technologies that have substantial impacts on the industry. Wade's ability to innovate within a collaborative environment has allowed him to consistently push the boundaries of what is possible in electronic assembly.

Collaborations

Throughout his career, Wade has had the privilege of working alongside talented individuals, including coworkers John J. Loparco and Dennis R. Barringer. These collaborations have fostered an environment of creativity and shared knowledge, enabling the team to conceive and develop advanced inventions that have contributed to the broader technological landscape.

Conclusion

Wade H. White's dedication to innovation and his impressive portfolio of patents position him as a leading inventor in the field of electronic assembly technologies. As he continues to work at IBM and collaborate with esteemed colleagues, Wade is poised to make even more significant contributions to the world of technology. His inventions not only enhance the functionality of electronic devices but also inspire future generations of inventors and engineers.

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