The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2010
Filed:
Nov. 29, 2007
Dennis R. Barringer, Wallkill, NY (US);
Robert R. Genest, Poughkeepsie, NY (US);
John J. Loparco, Poughkeepsie, NY (US);
Wade H. White, Hyde Park, NY (US);
Dennis R. Barringer, Wallkill, NY (US);
Robert R. Genest, Poughkeepsie, NY (US);
John J. Loparco, Poughkeepsie, NY (US);
Wade H. White, Hyde Park, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method and incorporated assembly is provided for cooling of an electronic device or component. The assembly comprises a thermal duct having a fixed duct portion and a removable duct portion. The portions each have complementary interlocking components to secure them to one another. Also a first attachment block is provided. The first attachment block has complementary interlocking portions with the fixed and removable duct portions such that the block can be secured at least partially to each of the fixed duct portion and the removable duct portion. A second attachment block is also provided that has a complementary interlocking portion with the removable duct portion. This second attachment block can be secured to one or more electronic devices requiring cooling.