Karimnagar, India

Vydhik Sharma Devaraju

This inventor holds 1 USPTO granted patent. Top assignee: Qualcomm Incorporated. Active years: 2026.


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Vydhik Sharma Devaraju: Innovator in Die Interconnect Architectures

Introduction

Vydhik Sharma Devaraju is a notable inventor based in Karimnagar, India. He has made significant contributions to the field of interconnect architectures, particularly in enhancing data link bandwidths. His innovative approach has led to the development of a patent that addresses critical challenges in data communication.

Latest Patents

Vydhik holds a patent titled "Apparatus and methods for establishing link bandwidths within die interconnect architectures." This patent describes methods and apparatuses that can establish data links with greater bandwidths within die-to-die interconnect architectures. The system-on-a-chip (SoC) includes an error status register, multiple data ports for a data link, and a processor that is electrically coupled to both the error status register and the data ports. The processor is capable of receiving error data from the error status register and determining which data ports are error-free. Based on this information, the processor can establish a bandwidth for the data link and initiate a link negotiation process with another device.

Career Highlights

Vydhik Sharma Devaraju is currently employed at Qualcomm Incorporated, a leading company in the technology sector. His work focuses on advancing the capabilities of interconnect architectures, which are essential for modern computing systems. His innovative contributions have positioned him as a key player in his field.

Collaborations

Some of Vydhik's coworkers include Santhosh Reddy Akavaram and Sang Tran. Their collaborative efforts contribute to the innovative environment at Qualcomm, fostering advancements in technology.

Conclusion

Vydhik Sharma Devaraju is a prominent inventor whose work in die interconnect architectures has led to significant advancements in data communication. His patent reflects his commitment to innovation and excellence in technology.

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