Endwell, NY, United States of America

Vova R Markovich

This inventor holds 1 USPTO granted patent. Top assignee: Endicott Interconnect Technologies, Inc.. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Vova R Markovich. Retrieved from https://idiyas.com/inventor/vova-r-markovich

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Vova R Markovich: Innovator in Circuitized Substrates

Introduction

Vova R Markovich is a notable inventor based in Endwell, NY (US). He has made significant contributions to the field of circuitized substrates, particularly through his innovative methods that incorporate advanced materials.

Latest Patents

Markovich holds a patent for a "Method of making circuitized substrate with a resistor." This method involves creating a circuitized substrate that includes a resistor made from a polymer resin combined with nano-powders. These nano-powders consist of a mixture of at least one metal component and at least one ceramic component. The ceramic component may include ferroelectric ceramics, high surface area ceramics, transparent oxides, or doped manganites. Additionally, the substrate can be utilized in electrical assemblies and information handling systems, such as personal computers.

Career Highlights

Vova R Markovich is currently employed at Endicott Interconnect Technologies, Inc. His work focuses on developing innovative solutions in the electronics industry, particularly in the area of circuitized substrates.

Collaborations

Some of his notable coworkers include Rabindra N Das and John M Lauffer, who contribute to the collaborative efforts in advancing technology at their workplace.

Conclusion

Vova R Markovich's contributions to the field of circuitized substrates highlight his innovative spirit and dedication to advancing technology. His patent reflects a significant step forward in the integration of advanced materials in electronic applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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