Vivekanand Kalaparthi

Title: Vivekanand Kalaparthi: Innovator in Through-Silicon Via Technology

Introduction

Vivekanand Kalaparthi is a notable inventor based in Burlington, VT (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of through-silicon vias (TSVs). His innovative work has implications for the advancement of integrated circuit design and manufacturing.

Latest Patents

Kalaparthi holds a patent for "Liner-free through-silicon-vias formed by selective metal deposition." This patent describes structures for a through-silicon via and methods of forming such structures. The invention includes a substrate with a trench and surfaces bordering the trench. Additionally, it features a through-silicon via that has a layer inside the trench, which is in direct contact with the substrate surfaces. This innovation enhances the efficiency and reliability of TSVs in semiconductor devices.

Career Highlights

Vivekanand Kalaparthi is currently employed at GlobalFoundries U.S. Inc., a leading semiconductor manufacturer. His role involves research and development in advanced semiconductor technologies. His expertise in through-silicon vias has positioned him as a key contributor to the company's innovative projects.

Collaborations

Kalaparthi has collaborated with talented professionals in his field, including David Thomas and Cody Soule. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Vivekanand Kalaparthi is a prominent inventor whose work in through-silicon via technology is paving the way for advancements in semiconductor manufacturing. His contributions are vital to the ongoing evolution of integrated circuit design.