This inventor holds 1 USPTO granted patent. Top assignee: Amoco Corporation. Active years: 1998.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1998
Title: Visveswaran Srinivasan: Semiconductor Encapsulation Invention
Introduction
Visveswaran Srinivasan is an inventor associated with Singapore. His patent work includes a process for preparing preforms used to encapsulate semiconductors and other electrical or electronic devices.
Latest Patents
Srinivasan is credited with 1 patent: “Process for Making Preforms Useful for Encapsulating Semiconductors.” The invention describes warming a thermoset resin to form a melt, injecting it into a mold, and cooling it into a solid molding without substantially curing the resin.
Career Highlights
Srinivasan’s listed company affiliation is Amoco Corporation. His patent addresses the preparation of molded preforms for use in encapsulating semiconductor and other electronic components.
Collaborations
His listed coworkers include Neep Hing Chin and Nicholas A. Rounds.
Conclusion
Visveswaran Srinivasan’s recorded patent contribution focuses on a process for producing thermoset resin preforms for semiconductor and electronic-device encapsulation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile