The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 1998
Filed:
Jun. 04, 1997
Applicant:
Inventors:
Palitha Mahendra Karunaratne, Singapore, SG;
Visveswaran Srinivasan, Singapore, SG;
Manuel Alameda Chua, Jr, Singapore, SG;
Neep Hing Chin, Singapore, SG;
Nicholas Andrew Rounds, New Britain, PA (US);
Assignee:
Amoco Corporation, Chicago, IL (US);
Primary Examiner:
Int. Cl.
CPC ...
B29C / ; B29C / ; B29C / ;
U.S. Cl.
CPC ...
2643285 ; 26432816 ; 26432817 ; 26427211 ;
Abstract
Preform useful for encapsulating semiconductors and other electric or electronic devices are prepared by a process which comprises warming thermoset resin to form a melt, injecting it into a mold, and cooling to form a solidified molding, all without substantially curing the thermoset resin.