Nicholas A Rounds

Title: Innovations of Nicholas A Rounds

Introduction

Nicholas A Rounds is a notable inventor based in New Britain, PA (US). He has made significant contributions to the field of semiconductor encapsulation, holding a total of 6 patents. His work has advanced the methods used in the manufacturing of electronic devices.

Latest Patents

Among his latest patents is a process for making preforms useful for encapsulating semiconductors. This innovative method involves warming thermoset resin to form a melt, injecting it into a mold, and cooling it to create a solidified molding, all without substantially curing the thermoset resin. Another significant patent is related to an improved transfer molding process for encapsulating semiconductor devices. This invention enhances the encapsulation of semiconductor, electrical, and optical devices with epoxy or other thermoset resins by providing a liner film over the surfaces of the package cavities, runners, and pot before inserting the preform tablet and devices.

Career Highlights

Throughout his career, Nicholas has worked with prominent companies such as Rohm and Haas Company and Amoco Corporation. His experience in these organizations has contributed to his expertise in the field of semiconductor technology.

Collaborations

Nicholas has collaborated with notable coworkers, including William D Emmons and Donald A Winey. Their combined efforts have furthered advancements in semiconductor encapsulation techniques.

Conclusion

Nicholas A Rounds is a distinguished inventor whose innovations in semiconductor encapsulation have made a lasting impact on the industry. His patents reflect a commitment to improving manufacturing processes for electronic devices.