This inventor holds 1 USPTO granted patent. Top assignee: Amoco Corporation. Active years: 1998.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1998
Title: Neep Hing Chin and Semiconductor Encapsulation Preforms.
Introduction
Neep Hing Chin is an inventor associated with Singapore. His patent work concerns preforms used to encapsulate semiconductors and other electrical or electronic devices.
Latest Patents
Chin is credited with 1 patent: “Process for Making Preforms Useful for Encapsulating Semiconductors.” The invention describes warming a thermoset resin to form a melt, injecting the melt into a mold, and cooling it into a solidified molding without substantially curing the resin.
Career Highlights
Chin’s listed patent is associated with Amoco Corporation. It focuses on preparing moldable resin preforms while preserving the thermoset resin’s ability to cure later, a process relevant to semiconductor and electronic-device encapsulation.
Collaborations
Chin’s listed coworkers include Manuel Alameda Chua, Jr. and Visveswaran Srinivasan.
Conclusion
Neep Hing Chin’s patent documents a process for producing thermoset resin preforms for encapsulating semiconductors and other electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile